The Teka SCA 2 receptacles are for use in through hole PCB mounting applications. Expanding upon our successful Solder Flux-Bearing Lead Technology, Teka has developed Solder- Flux Bearing Wafer Technology. This new technology enables a greater volume of solder than was previously possible, enabling 100% hole fill in PCB's up to .125" (3.2 mm) thick. All that is required is to place the SCA 2 connector on the PCB and reflow in a standard convection oven, without adding any additional solder, solder paste or flux. Provides IPC Class 3 solder joints Eliminate wave soldering Eliminate selective soldering Eliminate hand soldering or "touch up" Eliminate insufficient hole fill from intrusive reflow. Meets or exceeds FibreChannel, EIA and SFF Committee specifications. Click here to view a Shockwave® animated demonstration Click here for Product Quick View